Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8747579 | Solder layer and device bonding substrate using the same and method for manufacturing such a substrate | Yoshikazu Oshika, Masayuki Nakano | 2014-06-10 |
| 8516692 | Solder layer, substrate for device joining utilizing the same and method of manufacturing the substrate | Yoshikazu Oshika, Masayuki Nakano | 2013-08-27 |