DM

Danhuan Ma

DS Dow Silicones: 1 patents #322 of 722Top 45%
Overall (All Time): #2,689,729 of 4,157,543Top 65%
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Patent #TitleCo-InventorsDate
11485861 Method for applying thermally conductive composition on electronic components Peng Wei, Fengyi Su, Yan Zheng, Dorab Bhagwagar, Debo Hong +1 more 2022-11-01