Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11485861 | Method for applying thermally conductive composition on electronic components | Peng Wei, Yan Zheng, Dorab Bhagwagar, Debo Hong, Danhuan Ma +1 more | 2022-11-01 |
| 11338563 | Multilayer films and laminates containing slip agents | Andong Liu, Hongyu Chen, Jianping Pan, Xiao Bing Yun, Thomas Allgeuer +3 more | 2022-05-24 |
| 11090852 | Multilayer films and laminates containing slip agents | Andong Liu, Hongyu Chen, Jianping Pan, Xiao Bing Yun, Thomas Allgeuer +3 more | 2021-08-17 |
| 10538057 | High performance sealable co-extruded oriented film, methods of manufacture thereof and articles comprising the same | Jianping Pan, Xiaobing Yun, Rajen M. Patel, Yushan Hu, Yong Chen | 2020-01-21 |