Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10590272 | Thermosetting resin composition for frequency, and prepreg, laminated sheet and printed circuit board using same | Dong Hee JUNG, Moo-Hyun Kim, Do Woong Hong | 2020-03-17 |
| 10584239 | Thermosetting resin composition for frequency, and prepreg, laminated sheet and printed circuit board using same | Dong Hee JUNG, Moo-Hyun Kim, Do Woong Hong | 2020-03-10 |
| 9957389 | Thermosetting resin composition having heat resistance and low dielectric loss characteristics, prepreg using same, and copper clad laminate | Dong Hee JUNG, Duk Sang Han, Moo-Hyun Kim, Do Woong Hong | 2018-05-01 |
| 8802997 | Multi layer circuit board and manufacturing method of the same | Seung Min Hong, Ju Ho Shin | 2014-08-12 |