Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10590272 | Thermosetting resin composition for frequency, and prepreg, laminated sheet and printed circuit board using same | Dong Hee JUNG, Jeong Don Kwon, Moo-Hyun Kim | 2020-03-17 |
| 10584239 | Thermosetting resin composition for frequency, and prepreg, laminated sheet and printed circuit board using same | Dong Hee JUNG, Jeong Don Kwon, Moo-Hyun Kim | 2020-03-10 |
| 9957389 | Thermosetting resin composition having heat resistance and low dielectric loss characteristics, prepreg using same, and copper clad laminate | Dong Hee JUNG, Duk Sang Han, Jeong Don Kwon, Moo-Hyun Kim | 2018-05-01 |