Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12274036 | Heatsink for co-packaged optical switch rack package | Radhakrishnan L. Nagarajan, Liang Ding, Roberto Coccioli, Steve Aboagye | 2025-04-08 |
| 12128729 | Integrated optical transceiver | Ding Liang, Roberto Coccioli, Radhakrishnan L. Nagarajan | 2024-10-29 |
| 11791899 | Integrated optical transceiver | Ding Liang, Roberto Coccioli, Radhakrishnan L. Nagarajan | 2023-10-17 |
| 11777631 | In-packaged multi-channel light engine on single substrate | Radhakrishnan L. Nagarajan, Liang Ding, Roberto Coccioli | 2023-10-03 |
| 11719898 | Methods for co-packaging optical modules on switch package substrate | Radhakrishnan L. Nagarajan | 2023-08-08 |
| 11677478 | Method for co-packaging light engine chiplets on switch substrate | Radhakrishnan L. Nagarajan, Liang Ding, Roberto Coccioli, Steve Aboagye | 2023-06-13 |
| 11612079 | Heatsink for co-packaged optical switch rack package | Radhakrishnan L. Nagarajan, Liang Ding, Roberto Coccioli, Steve Aboagye | 2023-03-21 |
| 11381313 | Integrated compact in-package light engine | Ding Liang, Roberto Coccioli, Radhakrishnan L. Nagarajan | 2022-07-05 |
| 11218242 | In-packaged multi-channel light engine on single substrate | Radhakrishnan L. Nagarajan, Liang Ding, Roberto Coccioli | 2022-01-04 |
| 11178473 | Co-packaged light engine chiplets on switch substrate | Radhakrishnan L. Nagarajan, Liang Ding, Roberto Coccioli, Steve Aboagye | 2021-11-16 |
| 11165509 | Method for co-packaging light engine chiplets on switch substrate | Radhakrishnan L. Nagarajan, Liang Ding, Roberto Coccioli, Steve Aboagye | 2021-11-02 |
| 11109515 | Heatsink for co-packaged optical switch rack package | Radhakrishnan L. Nagarajan, Liang Ding, Roberto Coccioli, Steve Aboagye | 2021-08-31 |
| 10892830 | Integrated compact in-package light engine | Ding Liang, Roberto Coccioli, Radhakrishnan L. Nagarajan | 2021-01-12 |
| 10826613 | Integrated compact in-package light engine | Ding Liang, Roberto Coccioli, Radhakrishnan L. Nagarajan | 2020-11-03 |
| 9216604 | Stackable container systems and methods | — | 2015-12-22 |
| 8985018 | Stackable container systems and methods | — | 2015-03-24 |
| D687884 | Ink pad container | — | 2013-08-13 |
| 8205549 | Systems and methods for forming continuous ink images | — | 2012-06-26 |
| 8028622 | Stackable container systems for ink pads and method | — | 2011-10-04 |
| 7963221 | Systems and methods for forming continuous ink images | — | 2011-06-21 |
| 6812576 | Fanned out interconnect via structure for electronic package substrates | Siamak Fazelpour | 2004-11-02 |
| 6713853 | Electronic package with offset reference plane cutout | Siamak Fazelpour, Michel Fleury | 2004-03-30 |