| 12455423 |
Co-packaging optical modules with surface and edge coupling |
Rajkumar Nagarajan |
2025-10-28 |
|
| 12274036 |
Heatsink for co-packaged optical switch rack package |
Radhakrishnan L. Nagarajan, Liang Ding, Roberto Coccioli, Steve Aboagye |
2025-04-08 |
|
| 12128729 |
Integrated optical transceiver |
Ding Liang, Roberto Coccioli, Radhakrishnan L. Nagarajan |
2024-10-29 |
$241,753,000 |
| 11791899 |
Integrated optical transceiver |
Ding Liang, Roberto Coccioli, Radhakrishnan L. Nagarajan |
2023-10-17 |
$180,214,000 |
| 11777631 |
In-packaged multi-channel light engine on single substrate |
Radhakrishnan L. Nagarajan, Liang Ding, Roberto Coccioli |
2023-10-03 |
$142,755,000 |
| 11719898 |
Methods for co-packaging optical modules on switch package substrate |
Radhakrishnan L. Nagarajan |
2023-08-08 |
$160,430,000 |
| 11677478 |
Method for co-packaging light engine chiplets on switch substrate |
Radhakrishnan L. Nagarajan, Liang Ding, Roberto Coccioli, Steve Aboagye |
2023-06-13 |
$132,260,000 |
| 11612079 |
Heatsink for co-packaged optical switch rack package |
Radhakrishnan L. Nagarajan, Liang Ding, Roberto Coccioli, Steve Aboagye |
2023-03-21 |
$75,637,000 |
| 11381313 |
Integrated compact in-package light engine |
Ding Liang, Roberto Coccioli, Radhakrishnan L. Nagarajan |
2022-07-05 |
$44,112,000 |
| 11218242 |
In-packaged multi-channel light engine on single substrate |
Radhakrishnan L. Nagarajan, Liang Ding, Roberto Coccioli |
2022-01-04 |
$133,244,000 |
| 11178473 |
Co-packaged light engine chiplets on switch substrate |
Radhakrishnan L. Nagarajan, Liang Ding, Roberto Coccioli, Steve Aboagye |
2021-11-16 |
$126,416,000 |
| 11165509 |
Method for co-packaging light engine chiplets on switch substrate |
Radhakrishnan L. Nagarajan, Liang Ding, Roberto Coccioli, Steve Aboagye |
2021-11-02 |
$127,788,000 |
| 11109515 |
Heatsink for co-packaged optical switch rack package |
Radhakrishnan L. Nagarajan, Liang Ding, Roberto Coccioli, Steve Aboagye |
2021-08-31 |
|
| 10892830 |
Integrated compact in-package light engine |
Ding Liang, Roberto Coccioli, Radhakrishnan L. Nagarajan |
2021-01-12 |
$49,071,000 |
| 10826613 |
Integrated compact in-package light engine |
Ding Liang, Roberto Coccioli, Radhakrishnan L. Nagarajan |
2020-11-03 |
$19,536,000 |
| 9216604 |
Stackable container systems and methods |
— |
2015-12-22 |
|
| 8985018 |
Stackable container systems and methods |
— |
2015-03-24 |
|
| D687884 |
Ink pad container |
— |
2013-08-13 |
|
| 8205549 |
Systems and methods for forming continuous ink images |
— |
2012-06-26 |
|
| 8028622 |
Stackable container systems for ink pads and method |
— |
2011-10-04 |
|
| 7963221 |
Systems and methods for forming continuous ink images |
— |
2011-06-21 |
|
| 6812576 |
Fanned out interconnect via structure for electronic package substrates |
Siamak Fazelpour |
2004-11-02 |
$12,370,000 |
| 6713853 |
Electronic package with offset reference plane cutout |
Siamak Fazelpour, Michel Fleury |
2004-03-30 |
$11,946,000 |
