Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10991622 | Wafer processing method | Kentaro Odanaka, Masatoshi WAKAHARA, Wakana Onoe, Heidi Lan | 2021-04-27 |
| 10784166 | Wafer processing method | Kentaro Odanaka, Masatoshi WAKAHARA, Wakana Onoe, Heidi Lan | 2020-09-22 |
| 10777460 | Processing method of workpiece | Yukiko Matsumoto | 2020-09-15 |
| 10691090 | Method of processing device wafer | Masahisa Tokuyama | 2020-06-23 |
| 9934957 | Method of processing bonded wafer | Hirohiko Kozai, Kazuki TERADA | 2018-04-03 |