Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11105752 | Inspecting apparatus and processing apparatus including the same | Tomoaki Sugiyama, Naoki Morikawa | 2021-08-31 |
| 9934957 | Method of processing bonded wafer | Kazuki TERADA, Meiyu Piao | 2018-04-03 |
| 9396976 | Cutting apparatus | Yuji Nakanishi | 2016-07-19 |
| 9159623 | Wafer processing method for removing organic debris | Atsushi Hattori | 2015-10-13 |