Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315825 | Semiconductor device having wire pieces in bonding member | Daisuke Fukuoka, Tomomi Okumura, Yuuji Ootani, Wataru Kobayashi, Takumi Nomura +3 more | 2025-05-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315825 | Semiconductor device having wire pieces in bonding member | Daisuke Fukuoka, Tomomi Okumura, Yuuji Ootani, Wataru Kobayashi, Takumi Nomura +3 more | 2025-05-27 |