Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9999145 | Power module having packaging structure | Hsueh-Kuo Liao | 2018-06-12 |
| 9848518 | Integrated power module packaging structure | Te-Wei Yuan, Hsueh-Kuo Liao, Yi-Kai Chou, Ming-Yuan Tsai | 2017-12-19 |