Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5514622 | Method for the formation of interconnects and landing pads having a thin, conductive film underlying the plug or an associated contact of via hole | Roger Caldwell | 1996-05-07 |
JB
Johnathan G. Bornstein
Overall (All Time): #3,742,219 of 4,157,543Top 95%
1
Patents All Time