Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11718916 | Electroless Co—W plating film | Shoji IGUCHI, Akio Itamura, Shoichi Fukui, Masaaki Sato, Yoshihito Il +1 more | 2023-08-08 |
| 11049838 | Conductive bump and electroless Pt plating bath | Takuma Maekawa, Toshiaki Shibata, Yoshito Ii, Sho Kanzaki | 2021-06-29 |
| 10947623 | Electroless plating bath | Takuma Maekawa, Toshiaki Shibata | 2021-03-16 |
| 10763204 | Semiconductor device | Tomohito IWASHIGE, Kazuhiko Sugiura, Kazuhiro Miwa, Yuichi Sakuma, Seigo Kurosaka | 2020-09-01 |
| 8124174 | Electroless gold plating method and electronic parts | Seigo Kurosaka, Akira Okada, Ayumi Okubo, Masayuki Kiso | 2012-02-28 |
| 7985285 | Electroless gold plating bath, electroless gold plating method and electronic parts | Masayuki Kiso, Seigo Kurosaka, Tohru Kamitamari, Yoshikazu Saijo, Katsuhisa Tanabe | 2011-07-26 |
| 7678183 | Electroless palladium plating bath and electroless palladium plating method | Akihiko Murasumi, Seigo Kurosaka, Hiromu Inagawa | 2010-03-16 |