Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12206044 | Semiconductor component with a stress compensation layer and a method for manufacturing a semiconductor component | Christine Rafael, Paola Altieri-Weimar | 2025-01-21 |
| 10597183 | Apparatus for heat shrinking a package and method for heat shrinking a package | Stefan Landolt | 2020-03-24 |