RM

Rollin G. Meyer

CC Compaq Computer: 2 patents #518 of 1,604Top 35%
TI Teledyne Industries: 1 patents #209 of 517Top 45%
Overall (All Time): #2,298,921 of 4,157,543Top 60%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
5262594 Multilayer rigid-flex printed circuit boards for use in infrared reflow oven and method for assembling same Eric R. Edwin, James J. Tumlinson, Jerome A. Wilson, Thad McMillan, Darryl J. McKenney 1993-11-16
5178318 Multilayer rigid-flex printed circuit boards for use in infrared reflow oven and method for assembling same Eric R. Edwin, James J. Tumlinson, Jerome A. Wilson, Thad McMillan, Darryl J. McKenney 1993-01-12