Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6077383 | Device for separating wafers and process for using said device | — | 2000-06-20 |
| 5354711 | Process for etching and depositing integrated circuit interconnections and contacts | Michel Heitzmann, Jean Lajzerowicz | 1994-10-11 |
| 4491496 | Enclosure for the treatment, and particularly for the etching of substrates by the reactive plasma method | Louise Peccoud | 1985-01-01 |