| #50 |
Fuqiang Huang |
Shanghai Institute Of Ceramics, Chinese Academy Of Sciences |
7 |
| #52 |
Liangtao Zhu |
Caterpillar |
6 |
| #52 |
Yue Zuo |
Lear |
6 |
| #52 |
Bao Zhu |
Shanghai Integrated Circuit Manufacturing Innovation Center Co. |
6 |
| #52 |
Hong Shen |
Carefusion 2200 |
6 |
| #52 |
Zhonghua Xu |
Tyco Electronics (Shanghai) Co. |
6 |
| #57 |
Linhong Chen |
Futurewei Technologies |
5 |
| #57 |
Mingzhe Wang |
Brown University |
5 |
| #57 |
Yun-Wei Cao |
Nanosphere |
5 |
| #57 |
Yangxin FU |
Institute Of Biophysics, Chinese Academy Of Sciences |
5 |
| #57 |
Xueli Xu |
Beijing Aeonmed Co. |
5 |
| #62 |
Yao Jun DU |
Semiconductor Manufacturing International (Beijing) |
4 |
| #62 |
Xingquan Ma |
East China University Of Science And Technology |
4 |
| #62 |
Weichang Liu |
Conopco |
4 |
| #62 |
Dagang Huang |
Abbott |
4 |
| #62 |
Daniel Karraker |
Kohler |
4 |
| #62 |
Xiao Han |
Henkel Ag & Co. Kgaa |
4 |
| #68 |
Li Xia Wang |
Cabot Microelectronics |
3 |
| #68 |
Jinsong Wu |
Northwestern University |
3 |
| #68 |
Xiaojun Dang |
Nalco Company |
3 |
| #68 |
Zixiao Pan |
Flextronics Ap |
3 |
| #72 |
Robert Steven Murphy |
Saint-Gobain Performance Plastics |
2 |
| #72 |
Yishu Jiang |
Fudan University |
2 |
| #72 |
Yaofeng Chen |
University Of Illinois |
2 |
| #72 |
Jianrong Lin |
General Instrument |
2 |
| #72 |
Zhao Ting Liu |
Basf Se |
2 |