Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12198980 | Metal interconnection structure and manufacturing method thereof | Rui Yin, Wei Zhang | 2025-01-14 |
| 12159179 | Three-dimensional integrated system of RFID chip and super capacitor and preparation method thereof | Lin Chen, Qingqing Sun, Wei Zhang | 2024-12-03 |
| 11887912 | Through silicon via structure for three-dimensional integrated circuit packaging and manufacturing method thereof | Lin Chen, Qingqing Sun, Wei Zhang | 2024-01-30 |
| 11881442 | SOI active transfer board for three-dimensional packaging and preparation method thereof | Lin Chen, Qingqing Sun, Wei Zhang | 2024-01-23 |
| 11854939 | Three-dimensional integrated system of dram chip and preparation method thereof | Lin Chen, Qingqing Sun, Wei Zhang | 2023-12-26 |
| 10757661 | Communication device with passive proximity detection | — | 2020-08-25 |