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Scott Hinaga — 7 Patents

Cisco: 7 patents #2,035 of 13,007Top 20%
Palo Alto, CA: #2,978 of 9,675 inventorsTop 35%
California: #83,669 of 386,348 inventorsTop 25%
Overall (All Time): #680,018 of 4,157,543Top 20%
7 Patents All Time
Scott Hinaga has been granted 7 US patents while listed as an inventor at Cisco. The first was granted in 2013 and the most recent in April 2025. Scott Hinaga ranks #680,018 of 4,157,543 US inventors in our database (top 16.4%). Patent records list Scott Hinaga in Palo Alto, CA, US.

Patents per Year

Patents granted per year, 2013 to 2025Bar chart with a peak of 2 patents in 2023.peak 22013: 1 patents20132021: 1 patents20212022: 1 patents20222023: 2 patents20232024: 1 patents20242025: 1 patents2025

Issued Patents All Time

Showing 1–7 of 7 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
12289831 Providing one or more carbon layers to a copper conductive material to reduce power loss in a power plane Joel Richard Goergen, Jessica Kiefer, Alpesh Umakant Bhobe, Kameron Rose Hurst, D. Brice Achkir +2 more 2025-04-29
12160948 Integrating graphene into the skin depth region of high speed communications signals for a printed circuit board Joel Richard Goergen, Jessica Kiefer, Alpesh Umakant Bhobe, D. Brice Achkir, David Nozadze +3 more 2024-12-03 $37,655,000
11751322 Integrating graphene into the skin depth region of high speed communications signals for a printed circuit board Joel Richard Goergen, Jessica Kiefer, Alpesh Umakant Bhobe, D. Brice Achkir, David Nozadze +3 more 2023-09-05 $50,748,000
11706870 Providing one or more carbon layers to a copper conductive material to reduce power loss in a power plane Joel Richard Goergen, Jessica Kiefer, Alpesh Umakant Bhobe, Kameron Rose Hurst, D. Brice Achkir +2 more 2023-07-18 $35,626,000
11330702 Integrating graphene into the skin depth region of high speed communications signals for a printed circuit board Joel Richard Goergen, Jessica Kiefer, Alpesh Umakant Bhobe, D. Brice Achkir, David Nozadze +3 more 2022-05-10 $65,215,000
11202368 Providing one or more carbon layers to a copper conductive material to reduce power loss in a power plane Joel Richard Goergen, Jessica Kiefer, Alpesh Umakant Bhobe, Kameron Rose Hurst, D. Brice Achkir +2 more 2021-12-14 $49,059,000
8559678 Method and apparatus for determining surface roughness of metal foil within printed circuits Soumya De, Davie Senk 2013-10-15 $26,405,000

Frequent Collaborators

David Nozadze6 shared
D. Brice Achkir6 shared
Jessica Kiefer6 shared
Joel Richard Goergen6 shared
Amendra Koul6 shared
Alpesh Umakant Bhobe6 shared

Nearby-Ranked Inventors

Yu Du7
WOOSEUP YOUM7
Il Jae Moon7
Jacob Tyler Crosby7
Manamohan D. Mysore7
Timothy Batty7
Ty Hessler7
Justin Cole7
Xiaorong Chen7