SH

Scott Hinaga

CI Cisco: 7 patents #2,018 of 13,007Top 20%
Overall (All Time): #681,027 of 4,157,543Top 20%
7
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12289831 Providing one or more carbon layers to a copper conductive material to reduce power loss in a power plane Joel Richard Goergen, Jessica Kiefer, Alpesh Umakant Bhobe, Kameron Rose Hurst, D. Brice Achkir +2 more 2025-04-29
12160948 Integrating graphene into the skin depth region of high speed communications signals for a printed circuit board Joel Richard Goergen, Jessica Kiefer, Alpesh Umakant Bhobe, D. Brice Achkir, David Nozadze +3 more 2024-12-03
11751322 Integrating graphene into the skin depth region of high speed communications signals for a printed circuit board Joel Richard Goergen, Jessica Kiefer, Alpesh Umakant Bhobe, D. Brice Achkir, David Nozadze +3 more 2023-09-05
11706870 Providing one or more carbon layers to a copper conductive material to reduce power loss in a power plane Joel Richard Goergen, Jessica Kiefer, Alpesh Umakant Bhobe, Kameron Rose Hurst, D. Brice Achkir +2 more 2023-07-18
11330702 Integrating graphene into the skin depth region of high speed communications signals for a printed circuit board Joel Richard Goergen, Jessica Kiefer, Alpesh Umakant Bhobe, D. Brice Achkir, David Nozadze +3 more 2022-05-10
11202368 Providing one or more carbon layers to a copper conductive material to reduce power loss in a power plane Joel Richard Goergen, Jessica Kiefer, Alpesh Umakant Bhobe, Kameron Rose Hurst, D. Brice Achkir +2 more 2021-12-14
8559678 Method and apparatus for determining surface roughness of metal foil within printed circuits Soumya De, Davie Senk 2013-10-15