Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12289831 | Providing one or more carbon layers to a copper conductive material to reduce power loss in a power plane | Joel Richard Goergen, Jessica Kiefer, Alpesh Umakant Bhobe, Kameron Rose Hurst, D. Brice Achkir +2 more | 2025-04-29 |
| 12160948 | Integrating graphene into the skin depth region of high speed communications signals for a printed circuit board | Joel Richard Goergen, Jessica Kiefer, Alpesh Umakant Bhobe, D. Brice Achkir, David Nozadze +3 more | 2024-12-03 |
| 11751322 | Integrating graphene into the skin depth region of high speed communications signals for a printed circuit board | Joel Richard Goergen, Jessica Kiefer, Alpesh Umakant Bhobe, D. Brice Achkir, David Nozadze +3 more | 2023-09-05 |
| 11706870 | Providing one or more carbon layers to a copper conductive material to reduce power loss in a power plane | Joel Richard Goergen, Jessica Kiefer, Alpesh Umakant Bhobe, Kameron Rose Hurst, D. Brice Achkir +2 more | 2023-07-18 |
| 11330702 | Integrating graphene into the skin depth region of high speed communications signals for a printed circuit board | Joel Richard Goergen, Jessica Kiefer, Alpesh Umakant Bhobe, D. Brice Achkir, David Nozadze +3 more | 2022-05-10 |
| 11202368 | Providing one or more carbon layers to a copper conductive material to reduce power loss in a power plane | Joel Richard Goergen, Jessica Kiefer, Alpesh Umakant Bhobe, Kameron Rose Hurst, D. Brice Achkir +2 more | 2021-12-14 |
| 8559678 | Method and apparatus for determining surface roughness of metal foil within printed circuits | Soumya De, Davie Senk | 2013-10-15 |