Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12289831 | Providing one or more carbon layers to a copper conductive material to reduce power loss in a power plane | Joel Richard Goergen, Jessica Kiefer, Alpesh Umakant Bhobe, Kameron Rose Hurst, D. Brice Achkir +2 more | 2025-04-29 |
| 12160948 | Integrating graphene into the skin depth region of high speed communications signals for a printed circuit board | Joel Richard Goergen, Scott Hinaga, Jessica Kiefer, Alpesh Umakant Bhobe, D. Brice Achkir +3 more | 2024-12-03 |
| 12003282 | Channel predictive behavior and fault analysis | David Nozadze, Mike Sapozhnikov, Joel Richard Goergen, Arnav Shailesh Shah | 2024-06-04 |
| 11894296 | Integrated circuit package with heatsink | Mike Sapozhnikov, Sayed Ashraf Mamun, Tomer Osi, David Nozadze, Upendranadh R. KARETI +1 more | 2024-02-06 |
| 11781858 | Fiber weave skew assessment for printed circuit boards | Yaochao Yang, Mike Sapozhnikov, Joel Richard Goergen, Kartheek Nalla | 2023-10-10 |
| 11777239 | Twinaxial cable port structure coupled to an integrated circuit socket | Mike Sapozhnikov, Sayed Ashraf Mamun, Tomer Osi, David Nozadze, Upendranadh R. KARETI +1 more | 2023-10-03 |
| 11761755 | Fiber weave skew assessment for printed circuit boards | Yaochao Yang, Mike Sapozhnikov, Joel Richard Goergen, Kartheek Nalla | 2023-09-19 |
| 11751322 | Integrating graphene into the skin depth region of high speed communications signals for a printed circuit board | Joel Richard Goergen, Scott Hinaga, Jessica Kiefer, Alpesh Umakant Bhobe, D. Brice Achkir +3 more | 2023-09-05 |
| 11706870 | Providing one or more carbon layers to a copper conductive material to reduce power loss in a power plane | Joel Richard Goergen, Jessica Kiefer, Alpesh Umakant Bhobe, Kameron Rose Hurst, D. Brice Achkir +2 more | 2023-07-18 |
| 11606152 | Channel predictive behavior and fault analysis | David Nozadze, Mike Sapozhnikov, Joel Richard Goergen, Arnav Shailesh Shah | 2023-03-14 |
| 11425821 | Optimizing design and performance for printed circuit boards | Mike Sapozhnikov, David Nozadze, Joel Richard Goergen | 2022-08-23 |
| 11330702 | Integrating graphene into the skin depth region of high speed communications signals for a printed circuit board | Joel Richard Goergen, Scott Hinaga, Jessica Kiefer, Alpesh Umakant Bhobe, D. Brice Achkir +3 more | 2022-05-10 |
| 11293752 | Fiber weave skew assessment for printed circuit boards | Yaochao Yang, Mike Sapozhnikov, Joel Richard Goergen, Kartheek Nalla | 2022-04-05 |
| 11287245 | Fiber weave skew assessment for printed circuit boards | Yaochao Yang, Mike Sapozhnikov, Joel Richard Goergen, Kartheek Nalla | 2022-03-29 |
| 11202368 | Providing one or more carbon layers to a copper conductive material to reduce power loss in a power plane | Joel Richard Goergen, Jessica Kiefer, Alpesh Umakant Bhobe, Kameron Rose Hurst, D. Brice Achkir +2 more | 2021-12-14 |
| 10735039 | Removal of channel impairments due to skew and channel asymmetry with a composite filter | Joel Richard Goergen, Mike Sapozhnikov, David Nozadze, Upendranadh R. KARETI | 2020-08-04 |
| 10684123 | Fiber weave skew assessment for printed circuit boards | Yaochao Yang, Mike Sapozhnikov, Joel Richard Goergen, Kartheek Nalla | 2020-06-16 |
| 10674598 | Measuring effective dielectric constant using via-stub resonance | David Nozadze, Joel Richard Goergen, Mike Sapozhnikov | 2020-06-02 |