Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12160948 | Integrating graphene into the skin depth region of high speed communications signals for a printed circuit board | Joel Richard Goergen, Scott Hinaga, Jessica Kiefer, Alpesh Umakant Bhobe, D. Brice Achkir +3 more | 2024-12-03 |
| 12074081 | Use of bimetals in a heat sink to benefit heat transfer from high temperature integrated circuit components on a circuit board | Mahesh Daisy, Jerome Henry | 2024-08-27 |
| 11751322 | Integrating graphene into the skin depth region of high speed communications signals for a printed circuit board | Joel Richard Goergen, Scott Hinaga, Jessica Kiefer, Alpesh Umakant Bhobe, D. Brice Achkir +3 more | 2023-09-05 |
| 11330702 | Integrating graphene into the skin depth region of high speed communications signals for a printed circuit board | Joel Richard Goergen, Scott Hinaga, Jessica Kiefer, Alpesh Umakant Bhobe, D. Brice Achkir +3 more | 2022-05-10 |