TA

Tsukasa Akutsu

CC Circuit Foil Japan Co.: 1 patents #10 of 18Top 60%
FF Furukawa Circuit Foil.: 1 patents #8 of 18Top 45%
📍 Nikko, JP: #34 of 81 inventorsTop 45%
Overall (All Time): #2,244,203 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6153077 Process for preparing porous electrolytic metal foil Hitoshi Kato, Koichi Ashizawa 2000-11-28
4976826 Method of making electrodeposited copper foil Toshio Tani, Osamu Kamiyama, Noborn Matsuki, Ryosaku Fukuda, Hiroshi Nakatsugawa 1990-12-11