Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7508282 | Coupling device with electro-magnetic compensation | Jih-Hwa Lee, Joseph D. S. Deng | 2009-03-24 |
| 7222419 | Method of fabricating a ceramic substrate with a thermal conductive plug of a multi-chip package | Gwo-Ji Horng, Feng-Ger Hsiau | 2007-05-29 |