Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7222419 | Method of fabricating a ceramic substrate with a thermal conductive plug of a multi-chip package | Gwo-Ji Horng, Jen-I Kuo | 2007-05-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7222419 | Method of fabricating a ceramic substrate with a thermal conductive plug of a multi-chip package | Gwo-Ji Horng, Jen-I Kuo | 2007-05-29 |