Issued Patents All Time
Showing 26–50 of 65 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D776588 | Rearview mirror | — | 2017-01-17 |
| 9096044 | Flexible display panel and method of fabricating the same | Keh-Long Hwu, Chih-Jen Hu | 2015-08-04 |
| D718197 | Vehicle side view mirror | — | 2014-11-25 |
| D684492 | Warning light | — | 2013-06-18 |
| D662014 | Vehicle side view mirror | — | 2012-06-19 |
| D644151 | Vehicle side view mirror | — | 2011-08-30 |
| 7932165 | Method of making a semiconductor chip assembly with a laterally aligned filler and insulative base | Charles W. C. Lin | 2011-04-26 |
| D631805 | Vehicle side view mirror | — | 2011-02-01 |
| D631804 | Vehicle side view mirror | — | 2011-02-01 |
| 7876159 | Power amplifier circuit for multi-frequencies and multi-modes and method for operating the same | Shih-Ming Wang, Yu-Cheng Hsu, Chung-Chi Lai | 2011-01-25 |
| 7833827 | Method of making a semiconductor chip assembly with a bumped terminal, a filler and an insulative base | Charles W. C. Lin | 2010-11-16 |
| 7812671 | Transformer and structure thereof and power amplifier | — | 2010-10-12 |
| 7750483 | Semiconductor chip assembly with welded metal pillar and enlarged plated contact terminal | Charles W. C. Lin | 2010-07-06 |
| 7736483 | Method for electroplating metal wire | Chun-Yau Huang, Yong Wu, Cheng-Hung Tsai, Chwan-Gwo Chyau, Fang-Tsun Chu | 2010-06-15 |
| 7656031 | Stackable semiconductor package having metal pin within through hole of package | Chia-Chung Wang, Chin Hock Tan, Charles W. C. Lin | 2010-02-02 |
| 7632694 | Manufacturing method for a TFT electrode for preventing metal layer diffusion | Yu-Chang Sun, Yi-Hsun Huang, Chien-Wei Wu, Shuo-Wei Liang, Chia-Hsiang Chen +5 more | 2009-12-15 |
| D603774 | Vehicle side view mirror | — | 2009-11-10 |
| 7545038 | Bumping process and bump structure | Chun-Ping Hu, Chien-Wen Tsi, Yu-Ching Lee | 2009-06-09 |
| 7544600 | Bumping process and bump structure | Chun-Ping Hu, Chien-Wen Tsi, Yu-Ching Lee | 2009-06-09 |
| 7538415 | Semiconductor chip assembly with bumped terminal, filler and insulative base | Charles W. C. Lin | 2009-05-26 |
| 7459385 | Method of making a semiconductor chip assembly with a laterally aligned bumped terminal and filler | Charles W. C. Lin, Cheng-Lien Chiang | 2008-12-02 |
| 7453140 | Semiconductor chip assembly with laterally aligned filler and insulative base | Charles W. C. Lin | 2008-11-18 |
| 7425759 | Semiconductor chip assembly with bumped terminal and filler | Charles W. C. Lin | 2008-09-16 |
| 7417314 | Semiconductor chip assembly with laterally aligned bumped terminal and filler | Charles W. C. Lin, Cheng-Lien Chiang | 2008-08-26 |
| 7396703 | Method of making a semiconductor chip assembly with a bumped terminal and a filler | Charles W. C. Lin | 2008-07-08 |