Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10550688 | Apparatus for physical simulation experiment for fracturing in horizontal well layer by layer by spiral perforation and method thereof | Bing Hou, Yan Jin, Mian CHEN, Yunhu Lu, Botao Lin +2 more | 2020-02-04 |
| 7018929 | Method for reducing a low volatility byproduct from a wafer surface following an etching process | Yei-Ren Chen, Hung-Wen Chen, Chi-How Wu | 2006-03-28 |