ZF

Zhang Fan

CM Chartered Semiconductor Manufacturing: 2 patents #256 of 840Top 35%
PO Petsmart Home Office: 1 patents #29 of 35Top 85%
Samsung: 1 patents #49,284 of 75,807Top 70%
Overall (All Time): #368,182 of 4,157,543Top 9%
13
Patents All Time

Issued Patents All Time

Showing 1–13 of 13 patents

Patent #TitleCo-InventorsDate
12170862 10G rate OLT terminal transceiver integrated chip based on XGPON with DFB laser Jinghu Li, An Lin 2024-12-17
12113575 10G rate OLT terminal transceiver integrated chip based on XGSPON with EML laser Jinghu Li, An Lin 2024-10-08
12107623 10G rate OLT terminal transceiver integrated chip based on XGPON with EML laser Jinghu Li, An Lin 2024-10-01
12015244 DFB laser DC-coupled output power configuration scheme with adjustable voltage difference Jinghu Li, Liangqiong Shi, Weitan Yao, Weiyin Zheng, Hanghui Tu 2024-06-18
12003276 10G rate OLT terminal transceiver integrated chip based on EPON with EML laser Jinghu Li, An Lin 2024-06-04
11942985 10G rate OLT terminal transceiver integrated chip based on XGSPON with DFB laser An Lin, Jinghu Li 2024-03-26
11837847 DFB laser DC-coupled output power configuration scheme Jinghu Li, Liangqiong Shi, Weitan Yao, Weiyin Zheng, Hanghui Tu 2023-12-05
11695480 High-speed optical transceiver integrated chip drive circuit with phase delay compensation function Zhicong Luo, Jinghu Li, Fujie Chen, Qipeng Lin, An Lin +2 more 2023-07-04
11133871 Receiving and sending integrated chip for OLT Jinghu Li, Hanghui Tu 2021-09-28
D848083 Chew toy 2019-05-07
9443137 Apparatus and method for detecting body parts Liu Rong, Chen Maolin, Chang Kyu Choi, Ji Yeun Kim, Kee Chang Lee 2016-09-13
7276797 Structure and method for fabricating a bond pad structure Zhang Bei Chao, Liu Wuping, Chok Kho Liep, Hsia Choo, Lim Yeow Kheng +2 more 2007-10-02
6998335 Structure and method for fabricating a bond pad structure Zhang Bei Chao, Liu Wuping, Chok Kho Liep, Hsia Choo, Lim Yeow Kheng +2 more 2006-02-14