Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7276797 | Structure and method for fabricating a bond pad structure | Zhang Fan, Zhang Bei Chao, Liu Wuping, Hsia Choo, Lim Yeow Kheng +2 more | 2007-10-02 |
| 6998335 | Structure and method for fabricating a bond pad structure | Zhang Fan, Zhang Bei Chao, Liu Wuping, Hsia Choo, Lim Yeow Kheng +2 more | 2006-02-14 |
| 6403461 | Method to reduce capacitance between metal lines | Kim-Hyun Tae, Choi-Byoung Il | 2002-06-11 |