Issued Patents All Time
Showing 26–30 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11348873 | Wafer stacking method and wafer stacking structure | Ling-Yi Chuang | 2022-05-31 |
| 11320484 | Test method and test system | — | 2022-05-03 |
| 11205499 | Memory circuit device and a method for testing the same | — | 2021-12-21 |
| 10153041 | Dual inline memory module with temperature-sensing scenario mode | Fu-Yun Cheng, Ting-Yi Chang | 2018-12-11 |
| 9203409 | Wafer-level stacked chip assembly and chip layer utilized for the assembly | — | 2015-12-01 |