| 12431456 |
Package structure including a first non-conductive layer having a greater melt viscosity than a second non-conductive layer and method for fabricating the package structure |
— |
2025-09-30 |
| 12424505 |
Wafer warpage adjustment structure and method for manufacturing the same |
— |
2025-09-23 |
| 12426280 |
Semiconductor structure with increased number of stacked memory dies and method of manufacturing the same |
Kaimin LV |
2025-09-23 |
| 12374634 |
Chip structure and semiconductor structure comprising auxiliary bonding region above guard ring structure |
— |
2025-07-29 |
| 12347765 |
Semiconductor structure and method for fabricating same |
— |
2025-07-01 |
| 12261137 |
Bonding structure and method for forming the same |
— |
2025-03-25 |
| 12211813 |
Semiconductor structure and manufacturing method thereof |
— |
2025-01-28 |
| 12040298 |
Packaging method and packaging structure thereof |
— |
2024-07-16 |
| 11984417 |
Semiconductor structure and manufacturing method thereof |
— |
2024-05-14 |
| 11973045 |
Semiconductor structure and method for forming same |
— |
2024-04-30 |
| 11876064 |
Semiconductor structure and manufacturing method thereof |
— |
2024-01-16 |
| 11855032 |
Semiconductor structure and manufacturing method thereof |
— |
2023-12-26 |
| 11798885 |
Method of fabricating copper pillar bump structure with solder supporting barrier |
Dingyou LIN |
2023-10-24 |
| 11545468 |
Wafer stacking method and wafer stacking structure |
Shu-Liang Ning |
2023-01-03 |
| 11488917 |
Semiconductor structure and manufacturing method thereof |
— |
2022-11-01 |
| 11348873 |
Wafer stacking method and wafer stacking structure |
Shu-Liang Ning |
2022-05-31 |
| 11282789 |
Semiconductor structure, memory device, semiconductor device and method of manufacturing the same |
— |
2022-03-22 |
| 6802930 |
Method of making a laminated structure |
Li-Chang Lu |
2004-10-12 |