Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11798885 | Method of fabricating copper pillar bump structure with solder supporting barrier | Ling-Yi Chuang | 2023-10-24 |
| 11342236 | Wafer, semiconductor device and method for manufacturing the same | Chih-Wei Chang, Changhao Quan | 2022-05-24 |
| 11329049 | Memory transistor with cavity structure | Rongfu Zhu | 2022-05-10 |
| 11158639 | Asymmetric FinFET in memory device, method of fabricating same and semiconductor device | Rongfu Zhu | 2021-10-26 |