Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6706618 | Substrate processing apparatus, substrate support apparatus, substrate processing method, and substrate fabrication method | Takao Yonehara, Kenji Yamagata | 2004-03-16 |
| 6451670 | Substrate processing apparatus, substrate support apparatus, substrate processing method, and substrate fabrication method | Takao Yonehara, Kenji Yamagata | 2002-09-17 |
| 6383890 | Wafer bonding method, apparatus and vacuum chuck | Takao Yonehara, Kenji Yamagata | 2002-05-07 |
| 6309505 | Substrate processing apparatus and method | Takao Yonehara, Kenji Yamagata | 2001-10-30 |
| 5458755 | Anodization apparatus with supporting device for substrate to be treated | Yasutomo Fujiyama, Mitsuhiro Ishii, Senju Kanbe, Takao Yonehara, Akira Okita +3 more | 1995-10-17 |