Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5856775 | Programmable thin film filament resistor and method of constructing same | — | 1999-01-05 |
| 5202657 | Transmission lines for wafer-scale integration and method for increasing signal transmission speeds | — | 1993-04-13 |
| 5097232 | Transmission lines for wafer-scale integration and method for increasing signal transmission speeds | — | 1992-03-17 |
| 4920454 | Wafer scale package system and header and method of manufacture thereof | Cornelius C. Perkins | 1990-04-24 |
| 4847732 | Wafer and method of making same | Cornelius C. Perkins | 1989-07-11 |
| 4845315 | Cable system | — | 1989-07-04 |
| 4486705 | Method of testing networks on a wafer having grounding points on its periphery | — | 1984-12-04 |
| 4479088 | Wafer including test lead connected to ground for testing networks thereon | — | 1984-10-23 |
| 4467400 | Wafer scale integrated circuit | — | 1984-08-21 |
| 4460224 | Foldable circuit assembly | — | 1984-07-17 |
| 4458297 | Universal interconnection substrate | Richard A. Flasck | 1984-07-03 |
| 4183460 | In-situ test and diagnostic circuitry and method for CML chips | Raymond C. Yuen, Mark Anthony Pius MENEZES | 1980-01-15 |