Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4733813 | Method and apparatus for soldering elements on the corresponding pads of a wafer, in particular a wafer having high-density integrated circuits | Jean-Pierre Boiteau, Jean-Yves Vernon | 1988-03-29 |