Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5081949 | Apparatus for selective tinning of substrate leads | Claude Berneur | 1992-01-21 |
| 4985749 | Substrate for very large scale integrated circuit and apparatus for selective tinning of the substrate leads | Claude Berneur | 1991-01-15 |
| 4733813 | Method and apparatus for soldering elements on the corresponding pads of a wafer, in particular a wafer having high-density integrated circuits | Michel Le Meau, Jean-Yves Vernon | 1988-03-29 |