JC

Joseph Cheng

BE Boardtek Electronics: 2 patents #3 of 4Top 75%
Overall (All Time): #2,136,733 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
7585419 Substrate structure and the fabrication method thereof — 2009-09-08
7556984 Package structure of chip and the package method thereof — 2009-07-07