Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7737546 | Surface mountable semiconductor package with solder bonding features | Wai Hoong Moy, Chu Kun Tan, Keh Chin Seah | 2010-06-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7737546 | Surface mountable semiconductor package with solder bonding features | Wai Hoong Moy, Chu Kun Tan, Keh Chin Seah | 2010-06-15 |