KS

Keh Chin Seah

AP Avago Technologies Ecbu Ip (Singapore) Pte.: 2 patents #163 of 427Top 40%
AT Agilent Technologies: 1 patents #1,723 of 3,411Top 55%
Overall (All Time): #1,569,551 of 4,157,543Top 40%
3
Patents All Time

Issued Patents All Time

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
7737546 Surface mountable semiconductor package with solder bonding features Wai Hoong Moy, Chu Kun Tan, Paul Beng Hui Oh 2010-06-15
7261441 LED device and method for directing LED light Kee Yean Ng, Teong Heng Sim, Mohammad Zamri Zainal Abidin, Fakhrul Arifin Mohd Afif, Noor Azian Mat Jiwa 2007-08-28
6967123 Adhesive die attachment method for a semiconductor die and arrangement for carrying out the method Kee Yean Ng, Chong Hai Lee 2005-11-22