Brian Via — 2 Patents at Auburn University

Brian Via has been granted 2 US patents while listed as an inventor at Auburn University. The first was granted in 2019 and the most recent in January 2021. Brian Via ranks #1,709,992 of 4,157,543 US inventors in our database (top 41.1%). Patent records list Brian Via in Opelika, AL, US.

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #	Title	Co-Inventors	Date
10899039	Soy-modified resins for bonding wood	Sujit Banerjee	2021-01-26
10266694	Use of soy flour in resin formulations used to manufacture engineered wood composites	William G. Hand, Sujit Banerjee	2019-04-23