Issued Patents All Time
Showing 26–50 of 52 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7180395 | Encapsulated package for a magnetic device | Ashraf W. Lotfi, Mathew A. Wilkowski | 2007-02-20 |
| 6975788 | Optical switch having combined input/output fiber array | Nagesh R. Basavanhally, Mark Anthony Paczkowski, Hong Tang | 2005-12-13 |
| 6839517 | Apparatus and method for transmitting optical signals through a single fiber optical network | Felix Anigbo, Gerard Edmond Henein, Anpei Pan, Moon Soo Park, Yong-Kwan Park | 2005-01-04 |
| 6827500 | Precision two dimensional optical fiber array | Nagesh R. Basavanhally, Cristian A. Bolle, Paul Robert Kolodner, Rene R. Ruel | 2004-12-07 |
| 6633719 | Fiber array coupler | Nagesh R. Basavanhally, Ronald Edward Scotti | 2003-10-14 |
| 6588942 | Optical system having improved fiber-device coupling | Whitney White | 2003-07-08 |
| 6457836 | Mirror and a method of making the same | Edwin Arthur Chandross | 2002-10-01 |
| 6393187 | Optical fiber arrays with reduced return loss and methods for making same | Jon W. Engelberth | 2002-05-21 |
| 6382807 | Mirror and a method of making the same | Edwin Arthur Chandross | 2002-05-07 |
| 6351033 | Multifunction lead frame and integrated circuit package incorporating the same | Ashraf W. Lotfi | 2002-02-26 |
| 6281433 | Faceplate for network switching apparatus | Robert LeRoy Decker | 2001-08-28 |
| 6255587 | Multi-component electronic devices and methods for making them | William LAMBERT | 2001-07-03 |
| 6147341 | Temperature compensating device for fiber gratings | Paul J. Lemaire, Lloyd Shepherd | 2000-11-14 |
| 6144789 | Temperature compensating device for fiber gratings and a package therefor | Jon W. Engelberth, David J. Kudelko, Paul J. Lemaire, Paul M. Rominski | 2000-11-07 |
| 6110576 | Article comprising molded circuit | Robert LeRoy Decker | 2000-08-29 |
| 5939641 | System and method for empirically determining shrinkage stresses in a molded package and power module employing the same | Ashraf W. Lotfi | 1999-08-17 |
| 5925827 | System and method for empirically determining shrinkage stresses in a molded package and power module employing the same | Ashraf W. Lotfi | 1999-07-20 |
| 5787569 | Encapsulated package for power magnetic devices and method of manufacture therefor | Ashraf W. Lotfi, Karl E. Wolf, William L. Woods, Jr. | 1998-08-04 |
| 5773322 | Molded encapsulated electronic component | — | 1998-06-30 |
| 5754643 | Weatherable outside electronic device enclosure | Robert LeRoy Decker, Philip Hubbauer, William LAMBERT, Lloyd Shepherd, George J. Shevchuk | 1998-05-19 |
| 5696405 | Microelectronic package with device cooling | — | 1997-12-09 |
| 5689878 | Method for protecting electronic circuit components | Donald W. Dahringer, Philip Hubbauer, William LAMBERT, Alan Michael Lyons, Lloyd Shepherd | 1997-11-25 |
| 5659462 | Encapsulated, integrated power magnetic device and method of manufacture therefor | Shiaw-Jong Steve Chen, Ashraf W. Lotfi, Robert Joseph Roessler | 1997-08-19 |
| 5642276 | High frequency surface mount transformer-diode power module | Ashraf W. Lotfi, Lennart Pitzele | 1997-06-24 |
| 5627407 | Electronic package with reduced bending stress | Ephraim Suhir | 1997-05-06 |