Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6472307 | Methods for improved encapsulation of thick metal features in integrated circuit fabrication | Nace Layadi, Simon John Molloy, Kurt G. Steiner, Sylvia Thomas | 2002-10-29 |
| 6040616 | Device and method of forming a metal to metal capacitor within an integrated circuit | Joseph R. Radosevich, Ranbir Singh | 2000-03-21 |