Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12241690 | Thermal module structure | Sheng-Huang Lin | 2025-03-04 |
| 12215934 | Thermal module structure | Sheng-Huang Lin | 2025-02-04 |
| 12111113 | Heat transfer component reinforcement structure | Sheng-Huang Lin | 2024-10-08 |
| 12017879 | Paper blocking device | Wei-Fong Lin, Sheng-Kai Lin | 2024-06-25 |
| 11952230 | Thick document conveying device | Wei-Fong Lin, Chih-Yuan Yang | 2024-04-09 |
| 11917795 | Heat sink structure | Fu-Kuei Chang | 2024-02-27 |
| 11719491 | Heat transfer member reinforcement structure | Sheng-Huang Lin | 2023-08-08 |
| 11713202 | Foldable baffle structure | Chih-Yuan Yang | 2023-08-01 |
| 10813246 | Chassis heat dissipation structure | — | 2020-10-20 |
| 10727154 | Component coupled to heat dissipation unit | Sheng-Huang Lin | 2020-07-28 |
| 10247488 | Heat dissipation device | Sheng-Huang Lin | 2019-04-02 |
| 10181093 | Scanning device | Hung-Ming Chang | 2019-01-15 |
| 10021813 | Thermal module assembling structure | Yen-Lin Chu | 2018-07-10 |
| 9989321 | Heat dissipation device | — | 2018-06-05 |
| 9072176 | Assembling structure of heat dissipation device | — | 2015-06-30 |