Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11564329 | Heat dissipation device with multiple heat dissipation zones | Sheng-Huang Lin | 2023-01-24 |
| 10021813 | Thermal module assembling structure | Yuan-Yi Lin | 2018-07-10 |
| 9625218 | Method of manufacturing a heat dissipation device | Sheng-Huang Lin | 2017-04-18 |
| 9574830 | Mounting bracket for heat dissipation device having fins | Sheng-Huang Lin | 2017-02-21 |
| 8931972 | Thermal module mount structure | — | 2015-01-13 |
| 6998534 | Partition structure of a computer casing | — | 2006-02-14 |