Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11646284 | Method and apparatus to improve connection pitch in die-to-wafer bonding | Dongyun Lee | 2023-05-09 |
| 11404464 | Image sensing device and method of forming the same | Bo-Ray LEE | 2022-08-02 |
| 10589327 | Apparatus and method for rolling metal | Patricia A. Stewart, Neville Whittle, Dharma Maddala, Shawn Clark, Thomas J. Kasun +2 more | 2020-03-17 |
| 9425150 | Multi-via interconnect structure and method of manufacture | Yu-Fei Huang, Edward Wan, Jacob Chen, Dun-Nian Yaung, Cheng-Eng D. Chen | 2016-08-23 |
| 8022446 | Integrated Schottky diode and power MOSFET | Wan-Hua Huang, Kuo-Ming Wu, Yi-Chun Lin | 2011-09-20 |