Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7008867 | Method for forming copper bump antioxidation surface | — | 2006-03-07 |
| 6100107 | Microchannel-element assembly and preparation method thereof | Ten-Hsing Jaw, Chen-Kuei Chung, Dong-Sing Wuu, Ching-Yi Wu | 2000-08-08 |