Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12353258 | Sheet metal enclosure with an array of extruded heat transfer holes | Shrikant Bhadri, Ravindra Kulkarni | 2025-07-08 |
| 11825593 | Through board via heat sink | Navneet Gupta, Scott D. Brandenburg | 2023-11-21 |