| 12195379 |
Forming and bonding of glass components for portable electronic devices |
Andrew J. Meschke, Thomas Johannessen |
2025-01-14 |
|
| 12189439 |
Multi-part device enclosure |
Mikael Silvanto, Simon J. Trivett, Matthew Theobald, Dinesh C. Mathew, Simon R. Lancaster-Larocque +13 more |
2025-01-07 |
|
| 12114453 |
Core shell with various filler materials for enhanced thermal conductivity |
Andrew W. Meschke, Lei Gao, Abhijeet Misra, Alexander W. Williams, Hoishun Li +3 more |
2024-10-08 |
$261,024,000 |
| 11898808 |
Support plate thin cladding |
Robert F. Meyer, Michael D. Quinones, Jason P. Shannon, David A. Pakula |
2024-02-13 |
$152,277,000 |
| 11550369 |
Multi-part device enclosure |
Mikael Silvanto, Simon J. Trivett, Matthew Theobald, Dinesh C. Mathew, Simon R. Lancaster-Larocque +13 more |
2023-01-10 |
$215,259,000 |
| 11418638 |
Electronic device having a composite structure |
Abhijeet Misra, Steven J. Osborne, Ian A. Spraggs, Marwan Rammah |
2022-08-16 |
$228,519,000 |
| 11345121 |
Coloring of metallic materials coated with aluminum |
Yoshihiko Yokoyama, Naoto Matsuyuki, James A. Wright, Brian M. Gable, Eric W. Hamann |
2022-05-31 |
$175,196,000 |
| 11345980 |
Recycled aluminum alloys from manufacturing scrap with cosmetic appeal |
Brian M. Gable, Herng-Jeng Jou, Weiming Huang, Graeme William Paul, Eric W. Hamann +8 more |
2022-05-31 |
$175,196,000 |
| 11207795 |
Mold materials for formed ceramic |
Jeffrey Lee Mattlin, Abhijeet Misra, Herng-Jeng Jou, James A. Wright, James A. Yurko +2 more |
2021-12-28 |
$336,423,000 |
| 11111594 |
Processes to reduce interfacial enrichment of alloying elements under anodic oxide films and improve anodized appearance of heat treatable alloys |
James A. Curran, Eric W. Hamann |
2021-09-07 |
$276,522,000 |
| 10915151 |
Multi-part device enclosure |
Mikael Silvanto, Simon J. Trivett, Matthew Theobald, Dinesh C. Mathew, Simon R. Lancaster-Larocque +13 more |
2021-02-09 |
$402,075,000 |
| 10856443 |
Cladded metal structures for dissipation of heat in a portable electronic device |
Abhijeet Misra, Nagarajan Kalyanasundaram, James A. Yurko |
2020-12-01 |
$185,955,000 |
| 10787014 |
Thermally conductive structure for dissipating heat in a portable electronic device |
Lee E. Hooton, Marwan Rammah, James A. Bertin, Stoyan P. Hristov |
2020-09-29 |
$216,518,000 |
| 10711363 |
Anodic oxide based composite coatings of augmented thermal expansivity to eliminate thermally induced crazing |
James A. Curran, Zechariah D. Feinberg |
2020-07-14 |
$127,404,000 |
| 10616387 |
Portable electronic device |
Bryan D. Keen, Sina Bigdeli, Sawyer I. Cohen, Lucy E. Browning, Devon A. Monaco +2 more |
2020-04-07 |
$84,122,000 |
| 10597757 |
Ductile high-temperature molybdenum-based alloys |
Jiadong Gong, David R. Snyder, Jason T. Sebastian, Abhijeet Misra, James A. Wright |
2020-03-24 |
|
| 10447834 |
Electronic device having a composite structure |
Abhijeet Misra, Steven J. Osborne, Ian A. Spraggs, Marwan Rammah |
2019-10-15 |
$104,842,000 |
| 10174436 |
Process for enhanced corrosion protection of anodized aluminum |
James A. Curran, Aaron D. Paterson |
2019-01-08 |
$83,213,000 |
| 9970080 |
Micro-alloying to mitigate the slight discoloration resulting from entrained metal in anodized aluminum surface finishes |
James A. Curran, Abhijeet Misra |
2018-05-15 |
$62,463,000 |
| 9869623 |
Process for evaluation of delamination-resistance of hard coatings on metal substrates |
Eric W. Hamann, James A. Curran |
2018-01-16 |
$88,298,000 |
| 9359686 |
Processes to reduce interfacial enrichment of alloying elements under anodic oxide films and improve anodized appearance of heat treatable alloys |
James A. Curran, Eric W. Hamann |
2016-06-07 |
$71,315,000 |
