Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12000030 | Copper alloy film with high strength and high conductivity | Herng-Jeng Jou, Jacob L. Smith | 2024-06-04 | $189,142,000 |
| 11571082 | Pot cover assembly | Jun Lei, Wenhua Liu, Yunfeng Wang, Shufeng Huang, Deyong JIANG +1 more | 2023-02-07 | |
| 11345980 | Recycled aluminum alloys from manufacturing scrap with cosmetic appeal | Brian M. Gable, Herng-Jeng Jou, Graeme William Paul, William A. Counts, Eric W. Hamann +8 more | 2022-05-31 | $175,196,000 |
| 11207795 | Mold materials for formed ceramic | Jeffrey Lee Mattlin, Abhijeet Misra, Herng-Jeng Jou, James A. Wright, James A. Yurko +2 more | 2021-12-28 | $336,423,000 |
| 11021782 | Steel compositions and solution nitriding of stainless steel thereof | Hoishun Li, Ethan E. Currens, James A. Wright | 2021-06-01 | $199,177,000 |
| 10519529 | Nickel-based alloys | James A. Wright, Abhijeet Misra, Jeremy Li, Jiadong Gong, Dana Frankel | 2019-12-31 | |
| 10263938 | Message processing method and apparatus | Heng Chen, Yu Yin, Dengjing Cao | 2019-04-16 |