Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12009347 | Nano-tether micro LED structure | Andreas Bibl, Dariusz Golda, Chae Hyuck Ahn, Hyeun-Su Kim | 2024-06-11 |
| 11978825 | LED with internally confined current injection area | Kelly McGroddy, Hsin-Hua Hu, Andreas Bibl, Daniel Arthur Haeger | 2024-05-07 |
| 11404601 | Conductive micro LED architecture for on-wafer testing | Ranjith Samuel E. John, Adam C. Abrahamsen, Madhan Raj, Michael Chan, Nazneen N. Jeewakhan +1 more | 2022-08-02 |
| 11101405 | LED with internally confined current injection area | Kelly McGroddy, Hsin-Hua Hu, Andreas Bibl, Daniel Arthur Haeger | 2021-08-24 |
| 10593832 | LED with internally confined current injection area | Kelly McGroddy, Hsin-Hua Hu, Andreas Bibl, Daniel Arthur Haeger | 2020-03-17 |
| 9966260 | Surface modification process for laser application | Ion Bita, Ranjith Samuel E. John, Alfred Renaldo, Jie Fu, Sudirukkuge T. Jinasundera +1 more | 2018-05-08 |
| 9583466 | Etch removal of current distribution layer for LED current confinement | Kelly McGroddy, Hsin-Hua Hu, Andreas Bibl | 2017-02-28 |
| 9450147 | LED with internally confined current injection area | Kelly McGroddy, Hsin-Hua Hu, Andreas Bibl, Daniel Arthur Haeger | 2016-09-20 |
| 9153548 | Adhesive wafer bonding with sacrificial spacers for controlled thickness variation | Andreas Bibl | 2015-10-06 |
| 9121979 | Illumination devices and methods of fabrication thereof | Ion Bita, Sapna Patel, Suryaprakash Ganti, Brian W. Arbuckle | 2015-09-01 |
| 9087764 | Adhesive wafer bonding with controlled thickness variation | Andreas Bibl | 2015-07-21 |
| 8979349 | Illumination devices and methods of fabrication thereof | Ion Bita, Sapna Patel, Suryaprakash Ganti, Brian W. Arbuckle | 2015-03-17 |
| 8325409 | Periscoping vanes for smart windows | Srinivasan Sethuraman | 2012-12-04 |