Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7816165 | Method of forming a device by removing a conductive layer of a wafer | Timothy J. Brosnihan, John M. Sledziewski | 2010-10-19 |
| 7703339 | Flow sensor chip | Craig Core | 2010-04-27 |
| 7491566 | Method of forming a device by removing a conductive layer of a wafer | Timothy J. Brosnihan, John M. Sledziewski | 2009-02-17 |
| 5412987 | Folded cantilever beam accelerometer | John S. Bergstrom | 1995-05-09 |
| 4522072 | Electromechanical transducer strain sensor arrangement and construction | Sam S. Hartin, Koy B. Cook, Jr., David V. Kerns, Jr., Jimmy L. Davidson, Keith Warren | 1985-06-11 |