Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7321162 | Semiconductor package having reduced thickness | Tae Heon Lee | 2008-01-22 |
| 7115445 | Semiconductor package having reduced thickness | Tae Heon Lee | 2006-10-03 |
| 7102208 | Leadframe and semiconductor package with improved solder joint strength | Tae Heon Lee, Young Suk Chung | 2006-09-05 |
| 6696747 | Semiconductor package having reduced thickness | Tae Heon Lee | 2004-02-24 |
| 6525406 | Semiconductor device having increased moisture path and increased solder joint strength | Young Suk Chung, Sung Sik Jang, Jae Jin Lee, Tae Heon Lee, Hyung Ju Lee +3 more | 2003-02-25 |
| 6475827 | Method for making a semiconductor package having improved defect testing and increased production yield | Tae Heon Lee | 2002-11-05 |